Latent-heat-induced-deformation-of-PCB-substrate_2022_Case-Studies-in-Therma

dc.date.accessioned 2022-09-24T11:05:10Z
dc.date.available 2022-09-24T11:05:10Z
dc.date.issued 2022-09-24
dc.identifier.uri https://digitallibrary.mes.ac.in/handle/1/2974
dc.title Latent-heat-induced-deformation-of-PCB-substrate_2022_Case-Studies-in-Therma
dspace.entity.type
Files
Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
Latent-heat-induced-deformation-of-PCB-substrate_2022_Case-Studies-in-Therma.pdf
Size:
5.16 MB
Format:
Adobe Portable Document Format
Description:
License bundle
Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description:
Collections